Method of fabricating touch panel

ABSTRACT

A method of fabricating a touch panel is provided. A substrate having a touch-sensing region and a peripheral region is provided. A touch-sensing circuit layer including first sensing series, second meshed metal sensing pads, and peripheral circuits is formed on the touch-sensing region of the substrate. An insulating layer having first contact windows and second contact windows is formed on the substrate to cover the touch-sensing circuit layer. The first contact windows expose a portion of the second meshed metal sensing pads. A transparent conductive layer including second transparent bridge lines and transparent contact pads is formed on the insulating layer located in the touch-sensing region of the substrate. Each second transparent bridge line is electrically connected to two adjacent second meshed metal sensing pads through two first contact windows. Each transparent contact pad is electrically connected to the corresponding peripheral circuit through the second contact window.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan applicationserial no. 99132435, filed on Sep. 24, 2010. The entirety theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates generally to a method of fabricating a touchpanel, and more particularly to a method of fabricating a capacitivetouch panel.

2. Description of Related Art

Based on different ways of sensing, touch panels are generallycategorized into resistant touch panels, capacitive touch panels,optical sensing touch panels, surface acoustic wave touch panels, andelectromagnetic touch panels. The capacitive touch panels havingadvantages of excellent sensitivity, favorable reliability, anddurability have been extensively applied in electronic devices.

Normally, the capacitive touch panel includes a plurality of firstsensing series extending along a first direction and a plurality ofsecond sensing series extending along a second direction. Each of thefirst sensing series includes a plurality of first sensing pads and aplurality of first bridge portions serially connected together, and eachof the second sensing series includes a plurality of second sensing padsand a plurality of second bridge portions serially connected together.The first sensing pads and the second sensing pads together constitute asensing array. When a user touches the touch panel with a finger, thefirst sensing series and the second sensing series of the touch panelcause a variation in capacitance on a position where the finger touches.The change of capacitance is transformed into a sensing signal,transmitted to a control circuit board, arithmetically processed, andthereby a proper instruction is output to operate the electronic device.Besides, the first sensing pads and the second sensing pads are made ofindium tin oxide (ITO) in most cases, so as to enhance transmittance ofthe touch panel. However, overly high resistance of the ITO easily leadsto low touch sensitivity of the touch panel. To resolve said issue, thefirst bridge portions or the second bridge portions are partially madeof metallic materials instead of ITO according to the related art, andthereby the overly high resistance of the sensing series can be reduced.

The process of fabricating the touch panel is simplified in order tolower the manufacturing costs (e.g., fabrication of the uppermostinsulating layer is omitted). However, given the uppermost insulatinglayer is not formed, the first bridge portions or the second bridgeportions made of metallic materials are directly exposed to externalsurroundings, which easily results in metal oxidation and significantreduction of reliability and the life span of the touch panel.Additionally, if the contact pads that are located in the peripheralregion of the touch panel and connected to external circuits are made ofmetallic materials, the metal contact pads, before being connected tothe external circuits, are unavoidably exposed to the externalsurroundings directly, which is also likely to cause metal oxidation andsignificantly reduce the reliability and the life span of the touchpanel.

Hence, how to reduce the resistance of the sensing series and preventthe metallic material from oxidizing without increasing themanufacturing costs are issues that need to be immediately resolved.

SUMMARY OF THE INVENTION

The invention is directed to a method of fabricating a touch panel. Themethod is suitable for reducing manufacturing costs and improvingreliability of the touch panel.

The invention provides a method of fabricating a touch panel. The methodincludes following steps. A substrate is provided. The substrate has atouch-sensing region and a peripheral region. A touch-sensing circuitlayer is formed on the touch-sensing region of the substrate. Thetouch-sensing circuit layer includes a plurality of first sensingseries, a plurality of second meshed metal sensing pads, and a pluralityof peripheral circuits. Each of the first sensing series includes aplurality of first meshed metal sensing pads and a plurality of firstbridge lines. Each of the first bridge lines is respectively connectedbetween two adjacent first meshed metal sensing pads. An insulatinglayer is formed on the substrate to cover the touch-sensing circuitlayer. Here, the insulating layer has a plurality of first contactwindows and a plurality of second contact windows. The first contactwindows expose a portion of the second meshed metal sensing pads. Atransparent conductive layer is formed on the insulating layer locatedin the touch-sensing region. The transparent conductive layer includes aplurality of second transparent bridge lines and a plurality oftransparent contact pads. Each of the second transparent bridge lines iselectrically connected to two adjacent second meshed metal sensing padsthrough two first contact windows. The second meshed metal sensing padsand the second transparent bridge lines together constitute a pluralityof second sensing series. Each of the transparent contact pads iselectrically connected to the corresponding peripheral circuit throughthe second contact window.

According to an embodiment of the invention, the substrate includes aglass substrate, a plastic substrate, a printed circuit board, or adisplay panel.

According to an embodiment of the invention, the insulating layerincludes a transparent dielectric pattern layer and a frame patternlayer. The transparent dielectric pattern layer is located on thetouch-sensing region of the substrate. The frame pattern layer islocated on the peripheral region of the substrate.

According to an embodiment of the invention, a material of the framepattern layer includes black resin or color resin.

According to an embodiment of the invention, a material of thetransparent conductive layer includes indium tin oxide (ITO), indiumzinc oxide (IZO), and aluminum zinc oxide (AZO).

According to an embodiment of the invention, each of the first meshedmetal sensing pads includes a plurality of first bar-shaped metalpatterns parallel to one another and a plurality of second bar-shapedmetal patterns parallel to one another. The first bar-shaped metalpatterns and the second bar-shaped metal patterns are intersected.

According to an embodiment of the invention, an extending direction ofthe first bridge lines is substantially perpendicular to an extendingdirection of the second transparent bridge lines, an extending directionof the first bar-shaped metal patterns is substantially parallel to theextending direction of the first bridge lines, and an extendingdirection of the second bar-shaped metal patterns is substantiallyparallel to the extending direction of the second transparent bridgelines.

According to an embodiment of the invention, an extending direction ofthe first bridge lines is substantially perpendicular to an extendingdirection of the second transparent bridge lines, an included anglebetween an extending direction of the first bar-shaped metal patternsand the extending direction of the first bridge lines is approximately45 degrees, and an included angle between an extending direction of thesecond bar-shaped metal patterns and the extending direction of thefirst bridge lines is approximately 45 degrees.

According to an embodiment of the invention, a line width of each of thefirst bar-shaped metal patterns ranges from about 1 micrometer to about6 micrometers, and a line width of each of the second bar-shaped metalpatterns ranges from about 1 micrometer to about 6 micrometers.

According to an embodiment of the invention, the method further includesforming a plurality of dummy conductive patterns between the secondmeshed metal sensing pads and the first sensing series when the firstsensing series and the second meshed metal sensing pads are formed.Here, the dummy conductive patterns are electrically floated.

The invention further provides a method of fabricating a touch panel.The method includes following steps. A substrate is provided. Thesubstrate has a touch-sensing region and a peripheral region. Atouch-sensing circuit layer is formed on the touch-sensing region of thesubstrate. The touch-sensing circuit layer includes a plurality of firstsensing series and a plurality of second meshed metal sensing pads. Eachof the first sensing series includes a plurality of first meshed metalsensing pads and a plurality of first bridge lines. Each of the firstbridge lines is respectively connected between two adjacent first meshedmetal sensing pads. An insulating layer is formed on the substrate tocover the touch-sensing circuit layer. Here, the insulating layer has aplurality of first contact windows that expose a portion of the secondmeshed metal sensing pads. A plurality of second transparent bridgelines are formed on the insulating layer located in the touch-sensingregion. Each of the second transparent bridge lines is electricallyconnected to two adjacent second meshed metal sensing pads through twofirst contact windows. The second sensing pads and the secondtransparent bridge lines together constitute a plurality of secondsensing series. The second transparent bridge lines completely cover theportion of the second meshed metal sensing pads exposed by the firstcontact windows.

According to an embodiment of the invention, the method further includesforming a plurality of peripheral circuits in the peripheral region ofthe substrate when the touch-sensing circuit layer is formed. Theinsulating layer further has a plurality of second contact windowsexposing a portion of the peripheral circuits. The method furtherincludes forming a plurality of conductive layers on the insulatinglayer located in the touch-sensing region when the second transparentbridge lines are formed, such that the conductive layers completelycover the portion of the peripheral circuits exposed by the secondcontact windows.

According to an embodiment of the invention, the substrate includes aglass substrate, a plastic substrate, a printed circuit board, or adisplay panel.

According to an embodiment of the invention, each of the first meshedmetal sensing pads includes a plurality of first bar-shaped metalpatterns parallel to one another and a plurality of second bar-shapedmetal patterns parallel to one another. The first bar-shaped metalpatterns and the second bar-shaped metal patterns are intersected.

According to an embodiment of the invention, an extending direction ofthe first bridge lines is substantially perpendicular to an extendingdirection of the second transparent bridge lines, an extending directionof the first bar-shaped metal patterns is substantially parallel to theextending direction of the first bridge lines, and an extendingdirection of the second bar-shaped metal patterns is substantiallyparallel to the extending direction of the second transparent bridgelines.

According to an embodiment of the invention, an extending direction ofthe first bridge lines is substantially perpendicular to an extendingdirection of the second transparent bridge lines, an included anglebetween an extending direction of the first bar-shaped metal patternsand the extending direction of the first bridge lines is approximately45 degrees, and an included angle between an extending direction of thesecond bar-shaped metal patterns and the extending direction of thefirst bridge lines is approximately 45 degrees.

According to an embodiment of the invention, a line width of each of thefirst bar-shaped metal patterns ranges from about 1 micrometer to about6 micrometers, and a line width of each of the second bar-shaped metalpatterns ranges from about 1 micrometer to about 6 micrometers.

According to an embodiment of the invention, the method further includesforming a plurality of dummy conductive patterns between the secondmeshed metal sensing pads and the first sensing series when the firstsensing series and the second meshed metal sensing pads are formed.Here, the dummy conductive patterns are electrically floated.

Based on the above, the touch-sensing circuit layer made of the metallicmaterial, the insulating layer covering the touch-sensing circuit layer,and the transparent conductive layer located on the insulating layer aresequentially formed on the substrate in the invention. Hence,fabrication of the touch panel of the invention can prevent the metallicmaterial from being exposed and then oxidizing according to the relatedart in order to improve reliability of the touch panel. Besides, theentire touch panel can be formed by only performing three manufacturingprocesses. Thereby, manufacturing steps and costs can be effectivelyreduced, and the touch panel of the invention is adapted to massproduction.

In order to make the aforementioned and other features and advantages ofthe invention comprehensible, embodiments accompanied with figures aredescribed in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1 is a flow chart of a method of fabricating a touch panelaccording to an embodiment of the invention.

FIG. 2A is a schematic top view illustrating a touch panel according toan embodiment of the invention.

FIG. 2B is a schematic cross-sectional view taken along a line I-I inFIG. 2A.

FIG. 3 is a schematic top view illustrating a touch panel according toanother embodiment of the invention.

DESCRIPTION OF EMBODIMENTS

FIG. 1 is a flow chart of a method of fabricating a touch panelaccording to an embodiment of the invention. FIG. 2A is a schematic topview illustrating a touch panel according to an embodiment of theinvention. FIG. 2B is a schematic cross-sectional view taken along aline I-I in FIG. 2A. With reference to FIG. 1 and FIG. 2A, the method offabricating the touch panel in this embodiment includes steps S10˜S40.First, a substrate 110 is provided (step S10), and the substrate 110 hasa touch-sensing region 112 and a peripheral region 114. In thisembodiment, the substrate 110 is, for instance, a glass substrate, aplastic substrate, a printed circuit board, or a display panel.

With reference to FIG. 1 and FIG. 2A, a touch-sensing circuit layer 120is formed on the touch-sensing region 112 of the substrate 110 (stepS20). Specifically, the touch-sensing circuit layer 120 includes aplurality of first sensing series 122, a plurality of second meshedmetal sensing pads 124 a, and a plurality of peripheral circuits 126.The peripheral circuits 126 are electrically connected to the firstsensing series 122, respectively. Each of the first sensing series 122includes a plurality of first meshed metal sensing pads 122 a and aplurality of first bridge lines 122 b. Each of the first bridge lines122 b is respectively connected between two adjacent first meshed metalsensing pads 122 a. As indicated in FIG. 2A, the first sensing series122 of this embodiment extend along a first direction D1 and aredisposed on the substrate 110, and the first sensing series 122 areelectrically insulated from one another. The second meshed metal sensingpads 124 a extend along a second direction D2 and are disposed on thesubstrate 110, and the second meshed metal sensing pads 124 a areelectrically insulated from one another. The second direction D2 and thefirst direction D1 are substantially intersected. In this embodiment,the first direction D1 and the second direction D2 can be substantiallyperpendicular to each other, while an included angle between the firstdirection D1 and the second direction D2 can be any degree other than 90degrees in an alternative embodiment of the invention.

For instance, the meshed patterns of the first meshed metal sensing pads122 a and the second meshed metal sensing pads 124 a can be meshed metalin any shape, such as regularly arranged triangles, squares, rhombuses,rectangles, hexagons, polygons, crosses, or other shapes. The meshedpatterns can also be arranged in an irregular manner. According to thisembodiment, the meshed metal sensing pads are in the square shape. Eachof the first meshed metal sensing pads 122 a includes a plurality offirst bar-shaped metal patterns 121 a parallel to one another and aplurality of second bar-shaped metal patterns 123 a parallel to oneanother. The first bar-shaped metal patterns 121 a and the secondbar-shaped metal patterns 123 a are intersected. To be more specific, inthis embodiment, an included angle between an extending direction of thefirst bar-shaped metal patterns 121 a and an extending direction of thefirst bridge lines 122 b is about 45 degrees, for instance. An includedangle between an extending direction of the second bar-shaped metalpatterns 123 a and the extending direction of the first bridge lines 122b is about 45 degrees, for instance. Besides, when the substrate 110 isa display panel, a line width of each of the first bar-shaped metalpatterns 121 a exemplarily ranges from about 1 micrometer to about 10micrometers (preferably from about 1 micrometer to about 6 micrometers),and a line width of each of the second bar-shaped metal patterns 123 aexemplarily ranges from about 1 micrometer to about 10 micrometers(preferably from about 1 micrometer to about 6 micrometers), such thatthe first bar-shaped metal patterns 121 a and the second bar-shapedmetal patterns 123 a can be invisible. As clearly indicated in FIG. 2A,the first bar-shaped metal patterns 121 a and the second bar-shapedmetal patterns 123 a are connected at the intersections of the first andthe second bar-shaped metal patterns 121 a and 123 a.

In this embodiment, the shape of the second meshed metal sensing pads124 a is substantially the same as the shape of the first meshed metalsensing pads 122 a. That is to say, each of the second meshed metalsensing pads 124 a also includes a plurality of first bar-shaped metalpatterns 125 a parallel to one another and a plurality of secondbar-shaped metal patterns 127 a parallel to one another. The firstbar-shaped metal patterns 125 a and the second bar-shaped metal patterns127 a are intersected. To be more specific, in this embodiment, anincluded angle between an extending direction of the first bar-shapedmetal patterns 125 a and the extending direction of the first bridgelines 122 b is about 45 degrees, for instance. An included angle betweenan extending direction of the second bar-shaped metal patterns 127 a andthe extending direction of the first bridge lines 122 b is about 45degrees, for instance. Besides, a line width of each of the firstbar-shaped metal patterns 125 a exemplarily ranges from about 1micrometer to about 10 micrometers (preferably from about 1 micrometerto about 6 micrometers), and a line width of each of the secondbar-shaped metal patterns 127 a exemplarily ranges from about 1micrometer to about 10 micrometers (preferably from about 1 micrometerto about 6 micrometers), such that the first bar-shaped metal patterns125 a and the second bar-shaped metal patterns 127 a can be invisible.Similarly, as clearly indicated in FIG. 2A, the first bar-shaped metalpatterns 125 a and the second bar-shaped metal patterns 127 a areconnected at the intersections of the first and the second bar-shapedmetal patterns 125 a and 127 a.

According to this embodiment, a plurality of dummy conductive patterns150 can be selectively formed between the second meshed metal sensingpads 124 a and the first sensing series 122 when the first sensingseries 122 and the second meshed metal sensing pads 124 a are formed.Here, the dummy conductive patterns 150 are electrically floated.Namely, the dummy conductive patterns 150, the first sensing series 122,and the second meshed metal sensing pads 124 a are in the same filmlayer and are all made of metallic materials. The dummy conductivepatterns 150 are formed to effectively eliminate a cross-talk effectbetween the first sensing series 122 and the second meshed metal sensingpads 124 a, and thereby the touch sensitivity of the touch panel 100 acan be improved.

With reference to FIG. 1, FIG. 2A, and FIG. 2B, in step S30, aninsulating layer 130 is formed on the substrate 110 to cover thetouch-sensing circuit layer 120. The insulating layer 130 has aplurality of first contact windows 132 and a plurality of second contactwindows 134. The first contact windows 132 expose a portion of thesecond meshed metal sensing pads 124 a. The insulating layer 103 canselectively include a transparent dielectric pattern layer 136.Particularly, in this embodiment, the insulating layer 130 can includethe transparent dielectric pattern layer 136 and a frame pattern layer138. The transparent dielectric pattern layer 136 is located on thetouch-sensing region 112 of the substrate 110. The frame pattern layer138 is located on the peripheral region 114 of the substrate 110. Amaterial of the frame pattern layer 138 includes black resin or colorresin, for instance.

As indicated in FIG. 1, FIG. 2A, and FIG. 2B, in step S40, a transparentconductive layer 140 is formed on the insulating layer 130 located inthe touch-sensing region 112 of the substrate 110. To be more specific,the transparent conductive layer 140 of this embodiment includes aplurality of second transparent bridge lines 142 and a plurality oftransparent contact pads 144. Each of the second transparent bridgelines 142 is electrically connected to two adjacent second meshed metalsensing pads 124 a through two first contact windows 132. The secondmeshed metal sensing pads 124 a and the second transparent bridge lines142 together constitute a plurality of second sensing series 124. Anextending direction of the first bridge lines 122 b of the first sensingseries 122 is substantially perpendicular to an extending direction ofthe second transparent bridge lines 142.

In this embodiment, the first bridge lines 122 b are not in contact withthe second transparent bridge lines 142, and the first bridge lines 122b are located below the second transparent bridge lines 142. Inaddition, each of the transparent contact pads 144 is electricallyconnected to the corresponding peripheral circuit 126 through the secondcontact window 134, respectively. The peripheral circuit 126 locatedbelow each transparent contact pad 144 can be a single metal wire, aplurality of metal wires, or a metal pad. A material of the transparentconductive layer 140 is, for instance, ITO, IZO, or AZO. In brief, thefirst bridge lines 122 b and the second transparent bridge lines 142 ofthis embodiment are in different film layers. Namely, the first bridgelines 122 b are made of metallic materials, and the second transparentbridge lines 142 are made of non-metallic materials, e.g., ITO, IZO, orAZO. So far, the touch panel 100 a is formed. Since the touch-sensingcircuit layer 120 of this embodiment has the meshed metal with lowresistance, the conventional issue of low touch sensitivity caused bythe overly high resistance can be resolved in the invention. Besides,the second transparent bridge lines 142 and the transparent contact pads144 of this embodiment are made of transparent conductive metal oxide.Hence, even through the second transparent bridge lines 142 and thetransparent contact pads 144 are exposed to the air for a long period oftime, the conventional issue of the reduced resistance caused bynaturally oxidized metal does not exist in this invention.

To sum up, the touch-sensing circuit layer 120 made of metallicmaterials is formed on the substrate 110, and the insulating layer 130is foamed to cover the touch-sensing circuit layer 120 according to thisembodiment. The transparent conductive layer 140 is then formed on aportion of the insulating layer 130, and the second transparent bridgelines 142 are electrically connected to two adjacent second meshed metalsensing pads 124 a through the first contact windows 132 of theinsulating layer 130. Thereby, the touch panel 100 a of this embodimentis formed. In the aforesaid method, the touch-sensing circuit layer 120is covered by the insulating layer 130 and the transparent conductivelayer 140, and therefore the conventional issue of oxidized metallicmaterials caused by exposure to air can be prevented in this invention.Meanwhile, reliability and the life span of the touch panel 100 a can beincreased in this embodiment. Additionally, the touch panel 100 a ofthis embodiment can be formed by only performing three photolithographyprocesses and three etching processes. Hence, in comparison with thecomplicated processes of fabricating the conventional touch panel, thesimplified processes of fabricating the touch panel 100 a of thisembodiment can effectively reduce manufacturing costs.

It should be mentioned that the invention is not limited to the squaremeshed metal patterns described above, and thus the extending directionsof the first and the second bar-shaped metal patterns 121 a and 123 aare not restricted herein. Here, the included angle between theextending direction of the first bar-shaped metal patterns 121 a and theextending direction of the first bridge lines 122 b is about 45 degrees,and the included angle between the extending direction of the secondbar-shaped metal patterns 123 a and the extending direction of the firstbridge lines 122 b is about 45 degrees. However, in other embodiments ofthe invention, an extending direction of the first bar-shaped metalpatterns 121 b of the touch panel 100 b can be substantially parallel toan extending direction of the first bridge lines 122 b′, and theextending direction of the second bar-shaped metal patterns 123 b can besubstantially parallel to an extending direction of the secondtransparent bridge lines 142, as shown in FIG. 3. In other words, thefirst meshed metal sensing pads 122 a and the second meshed metalsensing pads 124 a depicted in FIG. 2A are merely exemplary and are notintended to limit the invention.

In light of the foregoing, the method of fabricating the touch panel ofthe invention can prevent the metallic material from being exposed andthen oxidizing, so as to improve reliability of the touch panel.Moreover, the entire touch panel can be formed by only performing threemanufacturing processes. As such, manufacturing steps and costs can beeffectively reduced.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the invention withoutdeparting from the scope or spirit of the invention. In view of theforegoing, it is intended that the invention cover modifications andvariations of this invention provided they fall within the scope of thefollowing claims and their equivalents.

1. A method of fabricating a touch panel, comprising: providing asubstrate having a touch-sensing region and a peripheral region; forminga touch-sensing circuit layer on the touch-sensing region of thesubstrate, the touch-sensing circuit layer comprising a plurality offirst sensing series, a plurality of second meshed metal sensing pads,and a plurality of peripheral circuits, each of the first sensing seriescomprising a plurality of first meshed metal sensing pads and aplurality of first bridge lines, each of the first bridge lines beingconnected between two adjacent first meshed metal sensing pads of thefirst meshed metal sensing pads; forming an insulating layer on thesubstrate to cover the touch-sensing circuit layer, the insulating layerhaving a plurality of first contact windows and a plurality of secondcontact windows, the first contact windows exposing a portion of thesecond meshed metal sensing pads; and forming a transparent conductivelayer on the insulating layer located in the touch-sensing region of thesubstrate, the transparent conductive layer comprising a plurality ofsecond transparent bridge lines and a plurality of transparent contactpads, each of the second transparent bridge lines being electricallyconnected to two adjacent second meshed metal sensing pads of the secondmeshed metal sensing pads through two of the first contact windows, thesecond meshed metal sensing pads and the second transparent bridge linesconstituting a plurality of second sensing series, each of thetransparent contact pads being electrically connected to a correspondingone of the peripheral circuits through one of the second contactwindows.
 2. The method as claimed in claim 1, wherein the substratecomprises a glass substrate, a plastic substrate, a printed circuitboard, or a display panel.
 3. The method as claimed in claim 1, whereinthe insulating layer comprises a transparent dielectric pattern layerand a frame pattern layer, the transparent dielectric pattern layer islocated on the touch-sensing region of the substrate, and the framepattern layer is located on the peripheral region of the substrate. 4.The method as claimed in claim 3, wherein a material of the framepattern layer comprises black resin or color resin.
 5. The method asclaimed in claim 1, wherein a material of the transparent conductivelayer comprises indium tin oxide, indium zinc oxide, and aluminum zincoxide.
 6. The method as claimed in claim 1, wherein each of the firstmeshed metal sensing pads comprises a plurality of first bar-shapedmetal patterns parallel to one another and a plurality of secondbar-shaped metal patterns parallel to one another, and the firstbar-shaped metal patterns and the second bar-shaped metal patterns areintersected.
 7. The method as claimed in claim 6, wherein an extendingdirection of the first bridge lines is substantially perpendicular to anextending direction of the second transparent bridge lines, an extendingdirection of the first bar-shaped metal patterns is substantiallyparallel to the extending direction of the first bridge lines, and anextending direction of the second bar-shaped metal patterns issubstantially parallel to the extending direction of the secondtransparent bridge lines.
 8. The method as claimed in claim 6, whereinan extending direction of the first bridge lines is substantiallyperpendicular to an extending direction of the second transparent bridgelines, an included angle between an extending direction of the firstbar-shaped metal patterns and the extending direction of the firstbridge lines is approximately 45 degrees, and an included angle betweenan extending direction of the second bar-shaped metal patterns and theextending direction of the first bridge lines is approximately 45degrees.
 9. The method as claimed in claim 6, wherein a line width ofeach of the first bar-shaped metal patterns ranges from about 1micrometer to about 6 micrometers, and a line width of each of thesecond bar-shaped metal patterns ranges from about 1 micrometer to about6 micrometers.
 10. The method as claimed in claim 1, further comprisingforming a plurality of dummy conductive patterns between the secondmeshed metal sensing pads and the first sensing series when the firstsensing series and the second meshed metal sensing pads are formed,wherein the dummy conductive patterns are electrically floated.
 11. Amethod of fabricating a touch panel, comprising: providing a substrate,the substrate having a touch-sensing region and a peripheral region;forming a touch-sensing circuit layer on the touch-sensing region of thesubstrate, the touch-sensing circuit layer comprising a plurality offirst sensing series and a plurality of second meshed metal sensingpads, each of the first sensing series comprising a plurality of firstmeshed metal sensing pads and a plurality of first bridge lines, each ofthe first bridge lines being connected between two adjacent first meshedmetal sensing pads of the first meshed metal sensing pads; forming aninsulating layer on the substrate to cover the touch-sensing circuitlayer, the insulating layer having a plurality of first contact windows,the first contact windows exposing a portion of the second meshed metalsensing pads; and forming a plurality of second transparent bridge lineson the insulating layer located in the touch-sensing region, each of thesecond transparent bridge lines being electrically connected to twoadjacent second meshed metal sensing pads of the second meshed metalsensing pads through two of the first contact windows, the secondsensing pads and the second transparent bridge lines constituting aplurality of second sensing series, the second transparent bridge linescompletely covering the portion of the second meshed metal sensing padsexposed by the first contact windows.
 12. The method as claimed in claim11, further comprising forming a plurality of peripheral circuits in theperipheral region of the substrate when the touch-sensing circuit layeris formed, the insulating layer further having a plurality of secondcontact windows exposing a portion of the peripheral circuits; forming aplurality of conductive layers on the insulating layer located in thetouch-sensing region when the second transparent bridge lines areformed, such that the conductive layers completely cover the portion ofthe peripheral circuits exposed by the second contact windows.
 13. Themethod as claimed in claim 11, wherein the substrate comprises a glasssubstrate, a plastic substrate, a printed circuit board, or a displaypanel.
 14. The method as claimed in claim 11, wherein each of the firstmeshed metal sensing pads comprises a plurality of first bar-shapedmetal patterns parallel to one another and a plurality of secondbar-shaped metal patterns parallel to one another, and the firstbar-shaped metal patterns and the second bar-shaped metal patterns areintersected.
 15. The method as claimed in claim 14, wherein an extendingdirection of the first bridge lines is substantially perpendicular to anextending direction of the second transparent bridge lines, an extendingdirection of the first bar-shaped metal patterns is substantiallyparallel to the extending direction of the first bridge lines, and anextending direction of the second bar-shaped metal patterns issubstantially parallel to the extending direction of the secondtransparent bridge lines.
 16. The method as claimed in claim 14, whereinan extending direction of the first bridge lines is substantiallyperpendicular to an extending direction of the second transparent bridgelines, an included angle between an extending direction of the firstbar-shaped metal patterns and the extending direction of the firstbridge lines is approximately 45 degrees, and an included angle betweenan extending direction of the second bar-shaped metal patterns and theextending direction of the first bridge lines is approximately 45degrees.
 17. The method as claimed in claim 14, wherein a line width ofeach of the first bar-shaped metal patterns ranges from about 1micrometer to about 6 micrometers, and a line width of each of thesecond bar-shaped metal patterns ranges from about 1 micrometer to about6 micrometers.
 18. The method as claimed in claim 11, further comprisingforming a plurality of dummy conductive patterns between the secondmeshed metal sensing pads and the first sensing series when the firstsensing series and the second meshed metal sensing pads are formed,wherein the dummy conductive patterns are electrically floated.